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System for metallization of openings without use of LPKF ProConduct chemicals buy in Moscow
Buy System for metallization of openings without use of LPKF ProConduct chemicals
System for metallization of openings without use of LPKF ProConduct chemicals

System for metallization of openings without use of LPKF ProConduct chemicals

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Russia, Moscow
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Description
LPKF ProConduct is a new original system for metallization of openings without use of chemicals which does not demand neither the cases nor dangerous himikaliyev. This compact system is unusually quickly and just adjusted and yields completely reliable and temperaturoustoychivy result for two-sided and multilateral printed circuit boards.
At a combination with the LPKF ProtoMat and LPKF MultiPress systems it is possible to make completely prototypes of printed circuit boards in one day.

Production of prototypes in vitro allows to reduce time for research and in shorter terms to bring production to the market. You save thereby means for maintenance outside the enterprise and reliably keep at yourself the important specifications.

The LPKF ProConduct® system uses the carrying-out paste which is specially developed polymeric by means of which the drilled openings by diameter to 0,5mm are metallized (19,7mdyuym). Thanks to fast and simple processing and production metallization takes place in several minutes.

On this subject you can read in addition in the section Multilayered printed circuit boards.

Max. size of material of a basis 229 mm x 305 mm (9" x 12")
Min. diameter of an opening 0,4 mm at a ratio of thickness of material to diameter of an opening 1:4 *
Quantity of the metallized openings on 1 payment it is not limited
Quantity of layers 4
Suitability for the soldering the soldering in the convection furnace 250 °C
Types of basic materials FR4, microwave substrates, such as PTFE
Process duration 35 min.
Electric resistance
(diameter of an opening of 0,4-1,0 mm
at a thickness of material of 1,6 mm)
average size is 19,2 megohms with a tolerance 7,7mom
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System for metallization of openings without use of LPKF ProConduct chemicals
System for metallization of openings without use of LPKF ProConduct chemicals
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