Thickness OSP analyzer (organic sheeting) ST2080-OSP
ST2080-OSP is intended for measurement of OSP (an organic sheeting) of thickness of the copper basis of PCB/PWB. As a nondestructive method of optical metrology from an ispolzovaniyemspektroskopichesky scatterometry, it allows to determine the average thickness of a covering and to provide detailed information of a 3D profile of a surface in real time without sample preparation. ST2080-OSP is applicable to real patterns on printed circuit boards of a substrate thanks to very small spot of measurement and function of automatic focusing. ST2080-OSP is based - on K-MAC of technology of measurement of thickness which reliability was proved in the field of the analysis of semiconductors, flat displays and others electronic a component.
ST2080-OSP provides a way of measurement of thickness of a covering of OSP contactless and nondestructive in real time on the printed circuit board with use of a scatterometry. ST2080-OSP provides fast and easy management of process of the analysis without the need for preparation of samples. The size of a measuring spot ST2080-OSP can be reduced to 0.135 that gives it the chance to measure OSP covering thickness on Cu with severe conditions poverkhnosti.st2080-OSP the UV-VIS-spectrometer based on a method of bunches, the consecutive electrochemical analysis and other methods of measurements is based on more reliable measuring technology, than. ST2080-OSP can receive a wide range of several lengths of waves from 420 nanometers to 640 nanometers. ST2080-OSP provides detailed data in several points and their average thickness which can help you to control OSP in more best way. ST2080-OSP can optimize process of control of production by means of the analysis of morphology of a 3-dimensional surface. In electronic industry, use of organic sheetings (OSP) of coverings is necessary for protection of Cu of a surface against oxidation. In the directive RoHS, sheetings demand use of lead, thanks to ease of processing and low prime cost. Typical range of thickness of a layer from 0,1 microns to 0,5 microns. ST2080-OSP measures thickness of thin films on the basis of use of the analysis of a spectral interference between light of the beams reflected from a film surface in a substrate and light, reflected from a substrate surface. ST2080-OSP measures several places at the same time and displays results of thickness in the form of a contour. ST2080-OSP has two appearance of optical lenses. Users can easily get access to different areas on a sample by means of a 5-fold optical lens and receive a detailed profile of thickness, using 50kh an optical lens.
|Range of lengths of waves||420nm ~ 640nm|
|Size of target area||864 X 648 microns / 86.4 X 64.8 microns|
|Range of measurements||350 Angstrom ~ 3 microns|
|Platform size||250 x 250 mm|
|Repeatability on axis Z||1 microns|
|The mechanism on axis Z||Z direction of the movement of the head
Movement range: 20 mm
At most a speed: 30 mm / with
|Functionality||Nondestructive OSP measurement of thickness
Lack of sample preparation
Coverings, available to detection of OSP, on Cu with severe conditions of a surface
result of a 3D contour